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High Speed Wavelength Conversion in a Heterogeneously Integrated Disc Laser Over Silicon On Insulator for Network on a Chip Applications
High Speed Wavelength Conversion Heterogeneously Integrated Disc Laser Over Silicon Insulator for Network Chip Applications
2015/7/15
We present the first BER results for wavelength conversion at 2.5Gb/s for an InP membrane Micro-Disc-Laser bonded on SOI substrate. Measured BER supports error-free operation when FEC is used. Operati...